![]() ![]() It is in that case recommended to acquire power supply unit with the increased power.Īlso, a considerable role is played by quantity of phases of a supply of the processor on the motherboard. The processor with the increased thermal packet (TDP) will give additional load of power supply unit of your notebook. It is necessary to pay attention, after changeover of the processor by more powerful - check compliance of the cooling system with a thermal packet of the set processor. ![]() Processors in the fcBGA casing are unsoldered on the notebook motherboard, their replacement is possible only in the presence of the equipment for BGA (ball grid array) of soldering. Processors in the rPGA casing can be replaced in house conditions. The possibility of replacement the processor depends on specific model of a notebook, a chipset (more precisely than the south bridge) and the processor set in a notebook! ![]()
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